GDK fully automatic solder paste printer XL for high precision and larger PCB board
Minimum pcb 50 * 50mm, maximum 650 * 610mm
Printing accuracy is 15um
Cycle time: 11S.
GDK solder paste printer X9+ and double lane SPI/AOI solution for referance:
PCB size:450mm * 350mm
For 0402/0201/01005 high precision board
3D inline SPI:
double lane, PCB size:500mm*330mm
FOV: 48mm*40mm 20um 5 mega pixels
2D inline double lane AOI:
FOV: 36mm*30mm 15um 5 mega pixels
With the development of electronic products to be smaller, portable and multi-functional, underfill becomes a necessary process for improving the reliability of electronic products. As for CSP, BGA and POP, the underfill can enhance their shock resistance; and as for FLIP CHIP which suffers from thermal stress due to inconsistent coefficient of thermal expansion (CTE) and ineffective welded ball, the underfill can strengthen its resistance against the thermal stress.