With the development of electronic products to be smaller, portable and multi-functional, underfill becomes a necessary process for improving the reliability of electronic products. As for CSP, BGA and POP, the underfill can enhance their shock resistance; and as for FLIP CHIP which suffers from thermal stress due to inconsistent coefficient of thermal expansion (CTE) and ineffective welded ball, the underfill can strengthen its resistance against the thermal stress.
In underfill, PCB & FPC manufacturers have to balance the output, materials, labor force and equipment investment and improve the after-sales service response speed and cost on the premise of ensuring underfill accuracy. The traditional needle underfill has low accuracy and efficiency. On the other hand, the use of foreign equipment can solve the problems concerning accuracy and efficiency, but the purchase and after-sales service cost is really huge for the PCB & FPC manufacturers.
The underfill equipment of offers great strengths for the manufacturers of different product layers from the small-scale production to online high capacity production. The system is equipped with the core jet valve of proprietary intellectual property rights, mature and stable operating platform and self-developed control software. It can meet various and specific user demands so as to greatly save the cost and improve both output and productivity. All the core parts are produced by ourselves and we have sufficient standby parts. A perfect service support network is established within the country to quickly respond to the customer demand, cut down the after-sales service cost, and accelerate the investment return of the PCB & FPC manufacturers.