L600 automatic solder paste printer which has the characteristics of high precision, high stability, high performance/price ratio and so on, is suitable for very large size PCB printing to 610x350mm.

1. Accuracy

    L600 patent mathematical model, repeat the accuracy of ± 15 microns (± 0.0005 ") @ 6 σ, Cp ≥ 2.0, To ensure that the  machine to achieve high-precision alignment.

2. HTGD dedicated PCB thickness adaptive system

    Simple and reliable structure, adaptive PCB thickness. Intelligent fast to achieve different thickness PCB board and its  transmission, clamping mechanism of the match.

3. Image and optical system

    The new optical system - uniform ring light and high brightness coaxial light, with all the brightness can be adjusted to the brightness, so that all types of Mark points can be a very good identification (including the rugged Mark point), to adapt Tin, copper, gold, spray tin, FPC, and other types of different colors of the PCB. Four light source adjustable, up and down with the same steel and PCB board.

4. Programmable suspension self-adjusting stepper motor drives the print head

    It is designed for the stability of the front and rear scraper pressure and the stability of the lift to prevent the solder paste from venting and the blade has a certain elastic clamping design. The pressure, the lifting speed, the printing speed and the printing range are adjustable and Customers provide a variety of stripping methods to meet the different requirements of the PCB board, to provide customers with a good printing control platform. Slide-type smart scraper system to improve operational stability and extend the service life.

5. HTGD printer PCB positioning system

    Unique flat belt conveyor rail, magnetic thimble, vacuum chamber, original flexible side pressure device and optional pressure device.

6. Cleaning system

    The system provides: dry cleaning, wet cleaning, vacuum three cleaning methods, the three ways can be used in any combination, and customers do not need automatic cleaning, the production interface can be achieved under the manual cleaning, thereby reducing the cleaning time, improve production effectiveness.

     The new wiping system ensures full contact with the stencil, and the increased vacuum suction ensures that the solder paste remaining in the mesh is effectively removed and the effective automatic cleaning function is achieved.

     Unique loading mechanism can adapt to different lengths of cleaning paper. The new concept of cleaning solution smear system can adapt to different width of the cleaning paper, reducing unnecessary waste of material. Safe, environmentally friendly.

7. Electronic control system

    The use of independent research and development of modular integrated circuits, safe, easy to repair; using the industry's most advanced industrial control system, the machine can be modified during the movement parameters, the real suspension function.

8. High adaptability steel mesh frame clamping system

    To achieve a variety of sizes of the network box printing, and can be achieved in the production process of rapid replacement models; Y to automatic positioning.

9. Easy to use graphical / medium interface

    Using windows XP operating system, independent research and development of graphical man-machine interface: in particular, to do the program file navigation effect, to facilitate all operators quickly familiar with the operation; menu in / English switch, operation log, fault record / fault self-diagnosis / failure Analysis tips / light alarm and other functions, making the operation simple and convenient.

10.2D solder paste printing quality inspection and analysis

     On the offset, less tin, missing printed, even tin and other printed problems can be quickly detected to ensure that the printing quality.

11. Platform system

      Using the United States Haydn linear motor drive, under the fine adjustment to achieve ultra-fine transmission, the machine more in line with the requirements of higher precision printing.

 

 

PCB 参数             PCB parameters  
最大板尺寸              Maximum board sizeX x Y 610mm x 350mm
最小板尺寸              Minimum board sizeX x Y 50mm x 50mm
PCB 厚度                PCB thickness 0.4mm~6mm
翘曲量                     Warpage Max. PCB  对角线 Diagonal line 1%
最大板重量             Maximum board weight 10Kg
板边缘间隙             Board margin gap 构形至 3mm    Configuration to 3mm
最大底部间隙         Maximum bottom gap 15mm
传送速度                Transfer speed 1500mm/s(Max)
距地面的传送高度   Transfer height from the ground 900±40mm
传送轨道方向         Transfer orbit direction -右,右-左,左-左,右-  Left-Right,Right-Left,Left-Left,Right-Right 
传输方式                Transfer mode 一段式轨道      One stage orbit
PCB 夹持方法        PCB damping method 软件可调性侧压(选项:一、底部整体吸腔式真空; 二、底部多点局部真空;三、边缘锁定基板夹紧)
Programmable flexible side pressure
(Optional: 1. Bottom integral suctionn cavity vacuum; 2. Multipoint partial vacuum of the bottom; 3. Edge locking and substrate clamping)
板支撑方法             Support method 磁性顶针,等高块,真空吸腔,专用工件夹具。
Magnetic thimble,  Equal high blocketc.(Optional:1.Vacuum suction cavity;2.Special workpiece fixture)
印刷参数            Printing parameters  
印刷头                    Printing head 直线马达闭环印刷头    Linear motor type close loop printing head
模板框架尺寸         Template frame size 420mm x 520mm~800 mm x 800 mm
最大印刷区域         Maximum printing areaX x Y 610mm x 350mm
刮刀类型                Squeegee type 钢刮刀、胶刮刀(角度45°/50°/60° 按印刷工艺匹配选择)
Steel scraper/Glue scraperAngel   45°/50°/60° matching the printing process
刮刀长度                Squeegee length 220mm~620mm
刮刀高度                Squeegee height 65±1mm
刮刀片厚度            Squeegee thickness 0.25mm Diamond-like carbon 涂层coating
印刷模式                Printing mode 单或双刮刀印刷      Single or double scraper printing
脱模长度                Demoulding length 0.02 mm - 12 mm
印刷速度                Printing speed 0 ~ 200 mm/s
印刷压力                Printing pressure 0.5kg - 10Kg
印刷行程                Printing stroke ±200 mm (从中心) (From the center)
影像参数             Image   parameters  
影像视域                 Field of view 10.24mm x 6.4mm
平台调整范围          Platform adjustment range X,Y:±7.0mm,θ:±2.0°
基准点类型              Benchmark point type 标准形状基准点(见SMEMA标准),焊盘/开孔 
Standard shape benchmark   point
SMEMA standard),solder pad/openings
摄像机系统              Camera system 独立照相机,向上/向下单独成像视觉系统,几何匹配定位
Independent   cameraupwards/downwards imaging vision system, geometric matching location
性能参数             Performance parameters  
影像校准重复精度   Repetition precision of image calibration ±15.0 微米micron @6 σCp ≥ 2.0
印刷重复精度          Repetition precision of printing ±25.0 微米micron @6 σCp ≥ 2.0
循环时间                 Cycle time 少于7s       7s
换线时间                 Product changeover 少于5mins     5mins
设备                   Equipment  
功率要求                Power requirements AC220V±10%,50/60HZ,15A
压缩空气要求         Compressed air requirements 4~6Kg/c. 10.0   直径管Diameter of the tube
操作系统                Operating system Windows XP
外观尺寸                External dimension 1140mm(L) x 1400mm(W) x 1480mm(H)(不含三色灯,显示器和键盘)(Without light,monitor and keyboard)
机器重量                Machine weight Around 1200Kg
温湿度控制模块 (选项)  Temperature and humidity control module(Optional)
环境温度      Environment temperat   23±3°C
相对湿度      Relative humidity 45~70%RH4
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L600 PCB stencil printer

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