SLE/SLE-D is used to detect and monitor the quality of solder paste printing. With the increasing precision of electronic products, SMD components are getting smaller and smaller, and the quality requirements of solder paste printing are also gradually increasing. SLE/SLE-D can effectively guarantee the printing quality, improve the printing quality, reduce the defect rate of products, save labor
Products

Product use: SLE/SLE-D is used to detect and monitor the quality of solder paste printing. With the increasing precision of electronic products, chip components are becoming smaller and smaller, and the requirements for solder paste printing quality are gradually increasing. SLE/SLE-D can Effectively guarantee the printing quality, improve the printing quality, reduce the defect rate of the product, save labor, and improve the production efficiency.

Functions & Features

1.High speed can achieve maximum throughput

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The all-digital high-speed CCD camera cooperates with the industrial telecentric lens, high resolution, ultra wide depth of field, ultra low distortion and unique parallel light design, etc. It can clearly image the circuit board and the tall components without strabismus.

23D raster projection head

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Realize shadowless 3D detection without worrying about inaccurate measurement caused by shadows; five-step phase shift algorithm based on defocused sine grating stripes, height detection accuracy up to 1μm

3Plate bending compensation solution

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Real-time measurement and compensation of board bending (refer to ideal board), can reach less than 2mm; provide clear PCB images and measurement data online in real time

 

4. Man-machine interface with easy operation 

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Support Gerber, CAD import, support offline programming and manual programming, easy to operate, can switch between Chinese and English system;

Through more intuitive software, display 2D/3D true color images to help users read bad; choose 2 commonly used Mark points.

 

5. High precision mechanical platform

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The AC servo motor system, coupled with precision ball screws and linear guide pairs, ensures high-speed and accurate detection capabilities, fast and stable movement, and positioning accuracy of less than 10μm.

6Supports Offline SPC

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Display histogram/control chart and true-color three-dimensional stereoscopic image, and export reports and pictures at any time period to trace the root cause of badness from the detection results.

Main Specifications

Model

SLE

SLE-D

Inspecion System

Camera Resolution

500 Mega Pixels

Lighting System

Surrounding RGB Light Source

FOV

48mm*40mm(20μm)

Processing Time Per Screen

<0.7s

Inspecting Content

Area, volume, height, shape, offset, even tin

Defect Type

Existence, more tin, less tin, continuous tin, offset, tip, collapse, irregular shape, insufficient height, height exceeding, etc.

Max. Inspecting Range

400μm

Solder Paste Size

0.2mm×0.2mm~12mm×12mm

Inspecting Height Precision

1μm

Repeatability (Size/Area/Height)

<1μm@3sigma

Repeatability and reproducibility

<10%

Software System

Operating System

Windows 7 Ultimate 64bit

Identification

Feature

3D grating projection head (double head optional)

Operate

Graphical programming, convenient operation, switchable Chinese and English systems

Display

2D/3D True Color Image

Mark Setting

Choose 2 commonly used Mark points

Programming

Support Gerber, CAD import, offline programming and manual programming

SPC

Offline SPC

Support

SPC Chart

Any time period report

Histogram/ Control Chart

Volume, area, height, offset

Export File

ReportExcel)、Imagejpgbmp

Mechanical System

PCB Deilivery Method

PCB fixing method: edge-locked substrate clamping; automatic access board and automatic width adjustment system, in line with SMEMA standards; track height: 900±30mm

Min. PCB Size

50mm×50mm 

50mm×50mm

Max. PCB Size

500mm×460mm

Double lane transmission: 500mm×330mm (one track, four tracks fixed or one track, three tracks fixed according to customer needs)

Single Lane Transmission500mm×600mm

PCB Thickness

0.6mm~6mm

Board Edge Gap

Top3mm  Bottom3mm( Width of transport belt contact with PCB/fixture )

Delivery Speed

1500mm/s(MAX)

Board Bending Compensation

<2mm

X,Y Platform

Driven Motor

Servo Motor System

Position Precision

<1μm

Moving Speed

600mm/s

Operating System

Computer PC

Industrial control computer: Intel high-end six-core CPU, 16GDDR memory, 1T hard disk

Monitor

22 Inch LCD widescreen monitor

Others

Exterior Dimension

L(1090mm)×W(1290mm)×H(1534mm) Without tri-color lights, monitor and keyboard

L(1090mm)×W(1500mm)×H(1534mm) Without tri-color lights, monitor and keyboard

Weight

750kg

    850kg

Power Requirement

AC220V±10%,50/60HZ,1.8kVA

Air Consumption Requirement

4~6Kg/cm²

Environment Temp.

10~40

Absolute Humidity

30-80%RH

                                                                                                                                                                                                        

SLE Exterior Dimension

单轨

SLE-D Exterior Dimension

双轨

SLE/SLE-D 3D SPI

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